Omega Micro Tech - Capabilities

High Density Fabrication and Packaging:

Ni/Au Plated Silver Substrates:
- OMT's proprietary process utilizes a multilayer ceramic substrate constructed exclusively with silver conductors which are then electrolessly plated with nickel followed by a thin layer of gold
- Using nickel/gold (Ni/Au) or a nickel/palladium/gold (Ni/Pd/Au) plating, a barrier to the Sn solder diffusion is created as well as achieving wire bondable, solderable and brazeable surfaces.
- Plateable Silver has a significant cost advantage over Gold.

Multi-Layer Cavities:
- Cavities create multi-layered structures with a reduced profile for stacking, creating short wire bonds, or for making flat surface mountable packages.

Complex 3-Dimensional Shapes:
- Complex novel shapes utilizing LTCC or heterogeneous material mix for difficult applications.

Package on Package:
- PoP approaches create multiple faces for surface mounting of IC’s and passive components while allowing three dimensional wiring, and embedded passives for the ultimate in high density applications.

High Value Buried Components:
High Value Embedded Capacitors
- High-k pastes for fabrication of embedded multilayer capacitors, achieving capacitances greater than 10nF, approaching 100nF.
High Value Embedded Toriod Inductors
- High-mu tapes and innovative inductor structures are used to achieve inductances as high as 150 nH for integrated inductors.
- 3-D structures are also utilized to enhance inductive effects and properties.

XOS Systems:
- 'X' on substrate, where 'X' refers to organic materials (LCP, Duroid, etc.), is a heterogeneous integration for lithographic features on organic substrates bonded with traditional multi-layer ceramics.
- To meet the demands of millimeter wave systems, OMT is developing novel mixed material systems.
- Known as XOS systems, the mixed material systems are combining polymer based materials such as LCP and Teflon based substrates with LTCC.

Constrained Sintering:
OMT is capable of producing constrained sintered substrates using various techniques.
- Pressure-less Assisted Sintering
- Self Constrained Tapes
- Tape on Substrate (TOS)

Polymer-Based Substrates:
- Where appropriate, OMT will advocate the use of all polymer systems in applications not subjected to harsh environments or not requiring the benefits of LTCC, thus lowering costs.
- Specific to this is the use of multilayer thin polymer systems, such as Hyrelex. Novel processes are being developed to allow for blind vias in laser free processing. These processes focus on the use of fillers for eliminating the bond-ply layer from filling the vias in the layers.

High Power Packages:
- Multi-layer Cooling Channels for multilevel cooling of three-dimensional designs.
- Alternative Materials for low thermal resistance
- Integration of Hard Materials co-fired with LTCC
- Large Surface Area Highly Thermally Conductive Materials