news1 = "open news page
Omega Micro Technologies awarded SBIR
March 15, 2011
Omega Micro Technologies, Inc. has been selected for award of N111-034 'Thermally Efficient Gallium Nitride Power Amplifier and Transmit / Receive Module Packaging (TEATRM)'.
'The objective of this SBIR is to demonstrate innovative cost effective packaging for high power Gallium Nitride(GaN) Power Amplifiers (PAs.) for Navy Shipboard Radars and Electronic Warfare (EW) Systems.'
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news2 = "open news page
FY11 Update:
Omega Micro Technologies, Inc. is completing work on N06-120 Phase II Option 'Vertically Integrated Advanced Microwave Package (VIAMP)'.
'The VIAMP will find a multitude of applications and uses ranging from highly integrated solutions to products requiring ultra-small form factors to mission critical circuitry requiring tightly controlled substrate characteristics. Furthermore, the development of the VIAMP will be an enabling technology for the continued size reduction required by many wireless markets such as cellular telephones, military unmanned aerial vehicle (UAV) applications, automotive and consumer electronics, surveillance applications, and advanced military handheld and airborne communications and data radios.'
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news3 = "open news page
FY11 Update:
Omega Micro Technologies, Inc. is completing work on its RF Alliance Project Year 2 Effort 'Reduced Gold Advanced Packaging'
'Program offices would like to use this process to reduce cost of [components]. The plating process will yield lower cost, higher reliability substrate designs with equivalent degradation in overall performance.'
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news4 = "open news page
Omega Micro Technologies awarded SBIR
December 29, 2010
Omega Micro Technologies, Inc. has been awarded N102-186 'Broadband Integrated Tunable Filter Module (BITFM).'
'The objective of this SBIR is to develop a wideband tunable BPF with unprecedented low insertion loss for small form-factor military transceivers designed to operate in the VHF and UHF bands.'
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news5 = "open news page
New Technology Brings Increased Reliability at Reduced Cost to Electronic Devices and Components.
March 1, 2010
'Officials of Omega Micro Technologies Inc. announce a new method to produce high reliability ceramic substrates for electronic devices used in military applications as well as automotive and commercial applications at a greatly reduced cost.'";
news6 = "
Read more at InsideIndianaBusiness.com";
news7 = "
Read more at RFAlliance.org";
news8 = "
'Purdue Research Park-based company Omega Micro Technologies, Inc., brings industry leading expertise in the design and fabrication of embedded, high-frequency circuitry in low temperature co-fired ceramic (LTCC) substrates.
The talents and expertise in RF and microwave design and development, as well as advanced substrate development and fabrication combine to offer full-service solutions to LTCC generated circuitry.
Having emerged from CTS Microelectronics, a former Purdue Research Parkbased company, the firm's combined staff brings clients more than 45 years of RF and microwave design experience and more than 120 years of substrate and microelectronics processing, fabrication and electronics industry experience.
An in-house, fully equipped LTCC foundry supports the company's low to medium volume production needs as well as producing prototype and developmental substrates for their customers.'
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news9 = "
'Omega Wireless Solutions has purchased the assets of CIS Microelectronics and has changed its name to Omega Micro Technologies, Inc.'
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